Dell PowerEdge MX750c

0.00$

PowerEdge MX750C

I/O Card for Fabric C

Chassis Configuration

RAID/Internal Storage Controllers

Processor

Memory Capacity

Hard Drives

Hard Drives (PCIe SSD)

Power Supply

Processor Thermal Configuration

I/O Card for Fabrics A or B

Boot Optimized Storage Cards

Internal SD Module

Сумма:

Add-ons total:

Всего:

Вес: 9.5 kg
Объем: 0.0063 m3
Размеры упаковки (HxWxL): 4.21x25.02x59.50 cm
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Technical Specifications

Processor:

Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor

Intel C620 series chipset with optional Intel QuickAssist Technology

Memory:

32 DDR4 DIMM slots, supports RDIMM max 2 TB or LRDIMM max 4 TB, speeds up to 3200 MT/s

Persistent Memory:

Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled

Availability:

Supports registered ECC DDR4 DIMMs only

Controllers:

Internal controllers: PERC H755 MX, PERC H745P MX, HBA350i MX, S150

Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB or Internal Dual SD Module (IDSDM) or USB

External PERC (RAID): PERC H745P MX

External HBAs (non-RAID): HBA330 MMZ

Drive Bays:

Front bays:

Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive

Up to 6 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive

Power Supplies:

MX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support

Fans:

MX7000 chassis: 5 rear and 4 front-accessible hot-swap fans with full redundancy

Dimensions:

Height: 42.15 mm (1.65 inches)

Width: 250.2 mm (9.85 inches)

Depth: 594.99 mm (23.42 inches)

Form Factor:

Up to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis

Embedded Management:

MX7000 chassis: OpenManage Enterprise Modular Edition (OME-Modular);

Up to 2 redundant MX9002m management modules

Unified control: single management point for server, storage, and networking

Intelligent automation: Operational template methodology and comprehensive RESTful API

Quick Sync 2 Bluetooth Low Energy (BLE)/wireless module

On compute sled:

iDRAC9

iDRAC Direct

iDRAC Service Module

OpenManage Software:

OpenManage Enterprise

OpenManage Power Manager plugin

OpenManage SupportAssist plugin

OpenManage Update Manager plugin

OpenManage Enterprise Modular Edition

Integrations and Connections:

OpenManage Integrations

BMC Truesight

Microsoft System Center

Red Hat Ansible Modules

VMware vCenter and vRealize Operations Manager

 

OpenManage Connections

IBM Tivoli Netcool/OMNIbus

IBM Tivoli Network Manager IP Edition

Micro Focus Operations Manager i

Nagios Core

Nagios XI

Integrated Security:

TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

Digitally Signed Firmware

Chassis Intrusion Alert

Secure Boot

Secure Erase

Silicon Root of Trust

System Lockdown (requires iDRAC Enterprise or Datacenter)

Networking_Options (NDC):

MX7000 chassis Fabric options: up to 2 pairs redundant general purpose switch or passthrough modular bays (Fabrics A and B);

redundant pair of storage specific switch bays (Fabric C)

Up to 25 Gb CNA/NIC per port for Mezz A/B, 32 Gb Fibre Channel, 12 Gbps SAS for Mezz C

Ports:

Front ports

1 x iDRAC Direct port (Micro-AB USB)

1 x USB 3.0

 

Internal port

1 x USB 3.0

PCIe:

One x16 PCIe Gen4 slot for Mezz A – connected to processor 1

One x16 PCIe Gen4 slot for Mezz B – connected to processor 2

One x16 PCIe Gen4 slot for Mini Mezz card – connected to processor 2

One x16 PCIe Gen4 slot for PERC – connected to processor 1

Two x8 PCIe Gen4 connectors for NVMe drive – connected to processor 1

One x8 PCIe Gen4 connectors for NVMe drive – connected to processor 2

Two x4 PCIe Gen3 slot for BOSS M.2 HW RAID card – connected to Platform Controller Hub (PCH)

Operating Systems and Hypervisors:

Canonical Ubuntu Server LTS

Citrix Hypervisor

Microsoft Windows Server with Hyper-V

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

VMware ESXi/vSAN