Dell PowerEdge MX750c

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PowerEdge MX750C

Motherboard

I/O Card for Fabric C

Embedded Systems Management

Chassis Configuration

BIOS and Advanced System Configuration Settings

Advanced System Configurations

RAID Configuration

RAID/Internal Storage Controllers

Processor

Additional Processor

Memory Capacity

Memory DIMM Type and Speed

Memory Configuration Type

Hard Drives

Hard Drives (PCIe SSD)

Trusted Platform Module

Power Supply

iDRAC Service Module

Group Manager

Processor Thermal Configuration

I/O Card for Fabrics A or B

Boot Optimized Storage Cards

Operating System

Licenses

OS Media Kits

Database Software

Client Access Licenses

iDRAC Systems Management Options

Additional Virtual Machines for Windows Server OS

Internal SD Module

SHIPPING

Regulatory

System Documentation

Shipping Material

OEM Regulatory

Solution Tracking

Consolidation Fees (EM-EMEA Only)

Dell Services: Deployment Services

Dell Services: Additional Deployment Services

Configuration Services Asset Report

BIOS Settings - Standard

Data Migration Services

Data Sanitization and Data Destruction for Enterpr

Custom Delivery Logistics

Anti Theft Device & Asset Tagging

Shipping Box Labels - Standard

Dell Services:GCP/OEM PM

CFI Order Ready

Configuration Services – Custom (Quoting Only)

Residency Services

Infrastructure Consulting Services (ICS)

Partner Operations Support

Dell Services:Training and Certification

Additional Documentation

Subtotal:

Add-ons total:

Total:

Weight: 9.5 kg
Volume: 0.0063 m3
Shipping box dimensions (HxWxL): 4.21x25.02x59.50 cm
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Technical Specifications

Processor:

Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor

Intel C620 series chipset with optional Intel QuickAssist Technology

Memory:

32 DDR4 DIMM slots, supports RDIMM max 2 TB or LRDIMM max 4 TB, speeds up to 3200 MT/s

Persistent Memory:

Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled

Availability:

Supports registered ECC DDR4 DIMMs only

Controllers:

Internal controllers: PERC H755 MX, PERC H745P MX, HBA350i MX, S150

Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB or Internal Dual SD Module (IDSDM) or USB

External PERC (RAID): PERC H745P MX

External HBAs (non-RAID): HBA330 MMZ

Drive Bays:

Front bays:

Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive

Up to 6 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive

Power Supplies:

MX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support

Fans:

MX7000 chassis: 5 rear and 4 front-accessible hot-swap fans with full redundancy

Dimensions:

Height: 42.15 mm (1.65 inches)

Width: 250.2 mm (9.85 inches)

Depth: 594.99 mm (23.42 inches)

Form Factor:

Up to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis

Embedded Management:

MX7000 chassis: OpenManage Enterprise Modular Edition (OME-Modular);

Up to 2 redundant MX9002m management modules

Unified control: single management point for server, storage, and networking

Intelligent automation: Operational template methodology and comprehensive RESTful API

Quick Sync 2 Bluetooth Low Energy (BLE)/wireless module

On compute sled:

iDRAC9

iDRAC Direct

iDRAC Service Module

OpenManage Software:

OpenManage Enterprise

OpenManage Power Manager plugin

OpenManage SupportAssist plugin

OpenManage Update Manager plugin

OpenManage Enterprise Modular Edition

Integrations and Connections:

OpenManage Integrations

BMC Truesight

Microsoft System Center

Red Hat Ansible Modules

VMware vCenter and vRealize Operations Manager

 

OpenManage Connections

IBM Tivoli Netcool/OMNIbus

IBM Tivoli Network Manager IP Edition

Micro Focus Operations Manager i

Nagios Core

Nagios XI

Integrated Security:

TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

Digitally Signed Firmware

Chassis Intrusion Alert

Secure Boot

Secure Erase

Silicon Root of Trust

System Lockdown (requires iDRAC Enterprise or Datacenter)

Networking_Options (NDC):

MX7000 chassis Fabric options: up to 2 pairs redundant general purpose switch or passthrough modular bays (Fabrics A and B);

redundant pair of storage specific switch bays (Fabric C)

Up to 25 Gb CNA/NIC per port for Mezz A/B, 32 Gb Fibre Channel, 12 Gbps SAS for Mezz C

Ports:

Front ports

1 x iDRAC Direct port (Micro-AB USB)

1 x USB 3.0

 

Internal port

1 x USB 3.0

PCIe:

One x16 PCIe Gen4 slot for Mezz A – connected to processor 1

One x16 PCIe Gen4 slot for Mezz B – connected to processor 2

One x16 PCIe Gen4 slot for Mini Mezz card – connected to processor 2

One x16 PCIe Gen4 slot for PERC – connected to processor 1

Two x8 PCIe Gen4 connectors for NVMe drive – connected to processor 1

One x8 PCIe Gen4 connectors for NVMe drive – connected to processor 2

Two x4 PCIe Gen3 slot for BOSS M.2 HW RAID card – connected to Platform Controller Hub (PCH)

Operating Systems and Hypervisors:

Canonical Ubuntu Server LTS

Citrix Hypervisor

Microsoft Windows Server with Hyper-V

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

VMware ESXi/vSAN